Thursday, 12 November 2015

The semiconductor industry mergers and acquisitions resulting in layoffs contine to spread.


A moderate down in the United States' semiconductor and remote business sector is prodding a few organizations to report cutbacks. It has additionally prompted huge mergers and acquisitions in the previous 20 months. This is changing the occupations scene for architects yet industry insiders aren't concerned.


Cellphone chip market pioneer Qualcomm announced that it would cut 15% of its workforce, which adds up to more than 4,500 individuals. Microsoft additionally plans let go of around 7,800 individuals, numerous connected with its Lumia cellphone business. Furthermore, Intel affirmed that cutbacks are in progress at that organization a month ago.







Among the major M&As in the previous two years are: Avago Technologies' securing of Broadcom for $37 billion; Intel's buy of Altera Corp for $16.7 billion; and NXP Semiconductor's buyout of Freescale Semiconductor for $12 billion. Some of these mergers have lead to extensive occupation misfortunes.


The slow-down in the semiconductor business is halfway on account of a full grown business sector in the U.S., says Will Strauss, president and vital examiner at statistical surveying firm Forward Concepts. The U.S. mobile phone business sector shrank in mid 2015 without precedent for a long time, he says. "The semiconductor droop will probably be with us for whatever remains of the year and possibly more. 



Everybody has a PC and a telephone here as of now. It's a soaked business sector."
In addition, cellphone chip creators face expanding rivalry from little Chinese sellers and Taiwan's MediaTek, which are making chips for low-end telephones that are popular in the blasting Asian markets.




Electronic Arksemi Feature: First Ever Transparent Perovskite Solar Cells Made With Graphene


A researcher at The Hong Kong Polytechnic University (HK PolyU) has added to the first-ever constructed semitransparent perovskite sun oriented cells with graphene as cathode. With basic preparing methods, sun oriented cells with high power change efficiencies can be created requiring little to no effort.

Firstly, the conductivity of graphene was drastically enhanced by covering a flimsy layer of conductive polymer amid the overlay procedure of graphene and perovskite layer.



Image: nanographene.org



Furthermore, multi-layer graphene is utilized as anodes to further enhance the proficiency of force transformation. The sheet resistance of the cathode could be further decreased while keeping up the high straightforwardness of the anodes.

In conclusion, the execution is further advanced by enhancing the contact between the top graphene cathodes and the gap transport layer on the perovskite movies.

On account of the great mechanical adaptability of graphene and the helpful readiness of the gadgets, this innovation can be utilized for the large scale manufacturing of the semitransparent perovskite sun based cells with printing or move to move process.

Exceptional Features and Advantages

• Transparency can be controlled

• High power change productivity ~ 12%

Semitransparent sun oriented cell innovation can be incorporated into the building outline, supplanting customary building materials. For example, exteriors, covers, louver, windows and rooftops,



Source:  PVBuz

Wednesday, 11 November 2015

Printed electronics for food packaging sensors

Technologies for creating gadgets require ever more noteworthy venture to deliver the most recent incorporated circuits. In spite of the fact that the expense per transistor keeps on diminishing in accordance with Moore's law, it is hard to utilize silicon-based gadgets for specific applications. Printed electronics  is an option innovation for manufacturing transistors and circuits utilizing suitable inks (for instance, natural semiconductors) and quick designing routines acquired from the realistic expressions space, for example, screen printing and gravure.


Image: www.mdpi.com




Printed hardware empowers ease installing of electronic capacities in items, for example, nourishment bundling, appearing well and good amounts like temperature and pH, which are essential for sustenance preservation. Utilizing sensors imprinted on the bundle, we can then precisely decide the preservation nature of the nourishment inside. This would make out of date the utilization of a foreordained close date, and hence would maintain a strategic distance from the disposing of a huge amount of nourishment that is protected and great to eat. The issue is that printed hardware is still in its earliest stages, and the execution of printed circuits is a long way from ideal. Specifically, the variability among diverse transistors, the low transistor speed, and the vicinity of numerous deformities present difficulties for the configuration and assembling of helpful printed circuits.


Read More at : Spie.org